Mini Micro Stencil offers BGA reballing services for your CBGA, PBGA, and TBGA.
BGA reballing
Reflow for the reattachment of solder spheres is done on a Sikama hot plate belt oven or APS GF-12.
Outsource your Reballing Needs: BGA reballing
- Reattachment of solder spheres BGA reballing
- Convection and conduction reflow BGA reballing
- Complete Turnkey service BGA reballing
- ESD workstations BGA reballing
- Professional staff with over 20 years experience BGA reballing
For
more information or quotes please contact
us. BGA
reballing
* Lead Time and pricing available on request. BGA
reballing
BGA Reballing Services
